Hymson recently released its third-quarter report for 2026. Revenue for the first nine months reached CNY 4.904 billion, up 81.38% year on year. Net profit attributable to shareholders of the parent company was CNY 133 million, reversing the loss in the corresponding period. Revenue and profitability both improved during the reporting period.
The report presents the core financial results as evidence of more stable growth, while pointing to orders and contract liabilities as leading operating indicators. By the end of June, new orders exceeded CNY 10 billion, an increase of approximately 150% year on year, and orders on hand were about CNY 20 billion, twice the previous-year level and a record since listing. According to the disclosure, most of those orders were expected to complete delivery and acceptance within one and a half years, supporting revenue development over the following two years.
Third-quarter contract liabilities were CNY 7.750 billion, up 109.63% from the end of 2025. For an equipment manufacturer, contract liabilities reflect customer advances and the timing of order fulfilment. The report interprets their increase as a larger pipeline for future revenue and improved earnings visibility. It describes simultaneous improvements in orders on hand, contract liabilities, revenue and profit as providing greater visibility over future growth.
Alongside operating performance, Hymson continues to use ultrafast lasers as a technical foundation for higher-value areas including AI computing infrastructure and semiconductor-related applications, with the aim of building longer-term growth.
Ultrafast lasers are an important part of precision processing for AI computing, semiconductors and advanced packaging. These applications frequently require customised processes, and standard equipment may not meet the needs of a particular production line. The report describes competition shifting from laser-source specifications alone to capabilities spanning the source, processing methods, integrated technologies and volume production.
Hymson says its experience of more than a decade in ultrafast lasers supports in-house source development and manufacture, volume production and delivery of complete process solutions. It positions itself among leading suppliers of customised ultrafast-laser and micro/nanoprocessing solutions, with application-specific process knowledge as a barrier to entry. Its AI-computing activities have begun contributing commercial results: chip rework, liquid-cooling equipment, AI-server power supplies and high-speed-cable automation have entered batch delivery. The company says it has joined the supply chains of major computing customers in China and overseas and is among the Chinese equipment suppliers qualified by leading North American computing customers.
For through-glass vias, or TGVs, Hymson describes itself as one of a limited number of Chinese suppliers able to deliver a substantial portion of a production line through in-house lasers, laser drilling and its own wet-etching team. It says it controls these core technologies internally and reports customer coverage exceeding 80%, including advanced-packaging, display and major overseas customers. The report argues that its vertical capabilities in sources, machines, processes and wet chemistry allow established new-energy equipment expertise to transfer into semiconductors, AI hardware and medical applications, reducing dependence on the capital-expenditure cycle of one industry and supporting faster deployment of new activities.